Industrial magnifying glass: used to detect the marking, surface texture, repainting, pin state, oxidation, new grinding marks, unknown residues, etc. of chips after magnifying components.

Insulation resistance tester: mainly used for insulation resistance and leakage of ultra-high value resistors, capacitors, various dielectric insulation materials, equipment, and wires and cables. Safety regulations require insulation testing quantity.

Precision LCR tester: mainly used for testing capacitance, resistance, inductance parameters, and can also measure impedance mode, admittance mode, loss factor, quality factor, reactance, admittance, phase angle and other parameters.

X-ray fluorescence spectrometer: used to test the content of harmful substances in electronic components, including lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls (PBB), polybrominated diphenyl ethers (PBDE), and other six harmful substances, to see if they comply with the RoHS directive requirements. The maximum limit standard is cadmium: 0.01% (100PPM); Lead, mercury, hexavalent chromium, polybrominated biphenyls (PBB), polybrominated diphenyl ethers (PBDE) 0.01% (1000PM).

X-Ray non-destructive fluoroscopy detector: X-Ray is a non-destructive radioactive inspection used for the internal structure of components. Usually used to inspect internal wafers, wires, and lead frames, and to compare the internal consistency of materials in the same batch and to recognize the internal consistency of samples.

Discrete device tester: mainly used for testing the electrical parameters of IGBT MOSFETs and transistors, and can also be used for general chip open circuit and IV curve measurement.

Lead free and environmentally friendly titanium tin furnace: used to measure the solderability of non BGA packaging devices, to eliminate welding defects caused by oxidation or pollution.

Metallographic microscope: used to check the logo of the wafer manufacturer, copyright year, and wafer code.

Chemical unpacking machine: used for capping testing, also known as DECAP, which belongs to destructive experiments. It uses chemical reagent methods to remove the external packaging shell of components and check the original factory identification on the surface of the wafer to determine the authenticity of the chip.

Electronic moisture-proof box: Electronic moisture-proof box is a storage device designed specifically for high sensitivity equipment such as electronic components and instruments. Its main function is to protect electronic equipment from pollutants such as moisture, dust, mold, etc., thereby alleviating the aging, damage, and failure problems of electronic equipment.